Unrivaled Flexibility for Prototyping & Production

Advanced Automatic Sub-Micron Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.

A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, this automatic flip chip bonder stands for highly stable assembly processes with the focus on maximum yield.

The new generation of the femto automated die bonding platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.

Depending on the requirements, the modular design of the automated die bonder FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes this automatic flip chip bonder a perfect tool and reliable companion as applications migrate from product development to production. This automated bonding system covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

"The FINEPLACER® femto 2 has enabled our company to realize higher throughput automation of our high accuracy flip chip bonding operations. As our high reliability opto-electronic transceiver business is expanding, this has helped us to satisfy our customer’s growing needs."
Howard Lenos
Ultra Communications, Inc.

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Key Facts*

  • Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates
  • Automatic placement accuracy calibration
  • Wide range of controlled bonding forces
  • UHD vision alignment system with FPXvisionTM
  • Multi-chip capability
  • Safe and controlled process environment with cleanroom quality
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Modular machine platform allows in-field retrofitting during entire service life
  • Large bonding area
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Ultra low bonding force
  • Individual configurations with process modules
  • Various bonding technologies in one recipe
  • Integrated scrubbing function
  • Process module compatibility across Finetech platforms
  • Wide range of supported component sizes
  • Synchronized control of all process related parameters
  • Process and material traceability via TCP (for MES)
  • Full process access & easy visual programming with touch screen interface
  • Data/media logging and reporting function
  • 3-color LED illumination
  • In-situ process observation in HD
  • Fully automatic and manual operation
  • Automatic tool management

*depending on configuration

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

  • Automatic Dipping Unit

    Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

  • Automatic Tool Changer

    Use different tools or tool tips, automatic exchange in process.

  • Automatic Tool Changer

    Use different tools or tool tips, automatic exchange in process.

  • Bar Code Reader "SmartIdent"

    Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

  • Bonding Force Module (automatic)

    Enhances the existing bond force range and allows the use of software controlled process forces.

  • Bonding Force Module (manual)

    Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

  • Camera Module (3D)

    For determining spatial coordinates of objects to be processed using image recognition (RGB lighting).

  • Camera Module (Up-Looking)

    For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).

  • Camera Y-Shift Module

    Allows extending the field of view in Y-direction.

  • Chip Heating Module

    Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

  • Component Presentation

    Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

  • Die Eject Module with Carousel

    Used to pick up components with the placement arm directly from blue tape with the use of different eject tools. Supports snap rings and wafer frames.

  • Die Eject Module

    Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

  • Die Flip Module

    Allows flipping of components prior to face-down assembly.

  • Direct Component Printing Module

    Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.

  • Dispense Module

    Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

  • Dual-Camera Optics

    Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.

  • FPXvisionTM

    Ensures a high resolution at all magnification levels.

  • Flip Chip Test Module

    The “Known Good Die" testing allows chip probing / testing prior to the bonding process.

  • Form Generator

    Software extension for creating and using virtual forms in the camera image to support relative and face-up alignment processes.

  • Formic Acid Module

    Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

  • Gap Adjustment Module

    For precisely setting a defined gap between component and substrate.

  • HEPA-Filter

    Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.

  • Handling Module

    Used to handle substrates or components independently from the bonding tool.

  • Height Scanner (3D camera)

    For determining heights, lengths and coordinates of objects to be processed by image recognition (RGB illumination/coaxial illumination).

  • Height Sensor (Autofocus)

    Allows automatic focus setting of component and substrate as well as height measurements.

  • Height Sensor (Laser)

    Allows sensing of heights by means of Laser triangulation for measuring purposes.

  • Height Sensor (mechanical)

    For determining heights, lengths and coordinates of objects to be processed by mechanical path measurement.

  • High Resolution Optics

    Allows using different achromatic lenses to adapt the field of view and optical resolution.

  • I/O Lift System

    Automatic substrate or boat unloading from magazines / loading into magazines.

  • I/O Panel Handling System

    Automatic loading and unloading of large panels or substrates.

  • ID Code Reader

    Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

  • Indexer/Conveyor

    For automatic loading / unloading of substrates. Width-adjustable for various substrate dimensions.

  • Laser Activation Module

    Activation / ignition of reactive materials such as nanofoils by laser pulse.

  • Laser Heating Module

    Allows ultra-fast heat cycles du to an integrated high power laser source

  • Lift Station

    Lifting objects from conveyor units into a processing position.

  • Manual Dipping Unit

    Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

  • Mask Generator "Scaled"

    Software extension for creating and projecting virtual masks to simplify alignment processes. These masks can be combined to scale from several objects.

  • Motorized Nick & Roll Motion

    Tilting unit with motorized angular adjustment in the axes phi(X) and phi(Y). This nick and roll movement can be used for parallel positioning or for bonding at certain angular positions.

  • Motorized Z Table

    Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.

  • Optics Shifting

    Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

  • Overlay vision alignment system (VAS) with fixed beam splitter

    Precise visual alignment of chip and substrate.

  • Pattern Recognition

    Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.

  • Plasma Cleaning

    Preparation of assembly surfaces using atmospheric plasma for better wetting during joining processes.

  • Precision Scale

    SPC (Statistical Process Control) for dispensing volumes in the automatic process flow.

  • Process Gas Module

    Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

  • Process Gas Selection

    Enhances a process gas module to handle two different gases for programmed selection in the process.

  • Process Video Module

    Allows the in-situ observation of the working area during the bonding process.

  • Programmable Wafer Changer with Cassette Lift

    Accommodates 300 mm wafer cassettes. Programmable speed and slots.

  • Scrubbing Module

    Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

  • Solder Removal Module

    Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

  • Substrate Heating Module

    Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

  • Substrate Support

    Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

  • Target Finder

    A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

    Read more (PDF, 0.3 MB)
  • Tool Tip Changer

    Use different tools or tool tips in process.

  • Traceability Module

    Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

  • Tray & Tape Feeder

    Infeed/outfeed of objects for automatic processing in larger quantities on a minimal presentation area.

  • UV Curing Module

    Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

  • Ultrasonic Module

    Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

  • Vacuum Chamber Module

    Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.

  • Wafer Changer

    Accommodates 300 mm wafer cassettes. Programmable speed and up to 24 slots.

  • Wafer Heating Module

    Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

  • Wafer Table

    Automatically positions and indexes the wafer over the Die-Ejector.

  • Zoom Optics

    Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.


FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder

The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.

FINEPLACER® femto 2 - Die Flipping Unit

Integrated die flip module automatically flips chips of various sizes and thickness. Can be used for chips that are presented with the bond side facing upward. Interchangeable platforms of the unit allow for component-specific adaptation.

Technical Paper

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