Desoldering, soldering, residual solder removal on flat panel TV PCB.
CSP Rework on Mobile Phones
Rework of GPU
Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.
Contactless Residual Solder Removal
Contactless solder removal (site dressing) showing alignment of tool and component, application of flux and the removal process.
01005 Small Passives Rework
Process camera video: desoldering of 01005 small passive with small gap.
Single Ball Reballing
Process camera video: removing a solder ball bridge in a BGA
Process camera video: removing a QFN component.
Process camera video: Active clamping soldering head for rework of PoP stacked components.
Direct Component Printing of QFN or MLF. No additional reflow process for solder transfer onto the component necessary. Minimum heat load to component. QFN rework in OEM quality!
Process camera video: Desoldering a µBGA component.