All around the world, customers rely on Finetech’s expertise. Working in close partnership, we create solutions that make a difference.
For the realization of a novel frequency comb technology, a research group from the Institute of Photonics at the Vienna University of Technology relied on flip chip and die bonding equipment from Finetech.
For the development and production of a particularly resilient transceiver module, Ultra Communications sought out Finetech’s high precision bonding equipment and experience with complex opto-electronics assembly.
How Finetech assisted the National Nanotechnology Research Center (UNAM) in Turkey during the COVID-19 pandemic to retrofit and successfully deploy their existing FINEPLACER® system for a demanding ultrasonic flip-chip bonding application.
With the help of a fully automated multi-chip bonder from Finetech, the Berlin-based laser specialists at Lumics have been able to improve reliability of their diode laser module manufacturing and to significantly increase production volume.
Dr. Shih-Wei Lin from the Micro Device Laboratory at NTHU, Taiwan, relies on the sub-micron die bonder FINEPLACER® lambda 2 for the development of innovative micro sensors and actuators for IoT, mobile phones and smart X.
How AEMtec uses advanced rework technology by Finetech to repair extremely valuable SMD assemblies worth as much as a car with a 100% success rate.
Kromek, leading developer of radiation detection products for SPECT and more, has been using Finetech bonders in prototype & production assembly.
The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer.
How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions.
Siemens AG in Fürth, Germany, successfully uses the hot air rework system FINEPLACER® coreplus for rework tasks in the production of electronics for industrial applications.
How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors.
How Finetech supports a high power fiber laser manufacturer to implement high-accuracy assembly processes for in-house developed high power diode pumps and to transfer them from prototyping into automatic series production.
The British CANDO project develops brain implants for epileptics which could actively avoid life-threatening seizures. Measuring only few micrometers, the implants are assembled with a FINEPLACER® high-precision die bonder.
Finetech’s versatile flip-chip die bonder is contributing to optoelectronics research at the UK’s top engineering university.
How an Asian display manufacturer successfully improved its yield up to 100% in production of small SMD LED carrier boards by employing a Finetech-developed multi-stage rework process.
Finetech ensures information flows right on time: Aditech’s modern LCD Displays for transportation and industrial applications are manufactured on multiple automated FINEPLACER® die bonders.
EMS provider Mair Elektronik relies on FINEPLACER® systems for the rework of high-speed camera systems and other high-quality SMD assemblies.
High-power laser diodes by Quantel Laser help achieve important scientific tasks aboard Mars-exploring “Curiosity” rover. They were assembled on precision die bonders by Finetech.
From the first to the 2000th board – Finetech designs reproducible processes for high-volume BGA rework.