Accuracy meets automation

Easy process transition from concept and development to production. For your ideas in series.

Finetech die bonders for fully-automated industrial micro assembly combine optimized throughput with high placement accuracy and unrivaled process flexibility.

Due to their modular platform design, automated systems by Finetech can be easily adjusted to the ever-changing technological trends, becoming a future-proof investment and a perfectly fitting solution for your production needs.

Automatic Packaging of Single Diode Lasers and Multi-Emitter Laser Modules

How Finetech supports a fiber laser manufacturer to develop and produce their own high power laser diode pumps.

Read the story
Read more stories

Contact Us

This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.
This field is required.