Advanced Sub-Micron Bonder

Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

Use different tools or tool tips, automatic exchange in process.

Use different tools or tool tips, automatic exchange in process.

Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

For determining spatial coordinates of objects to be processed using image recognition (RGB lighting).

For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).

Allows extending the field of view in Y-direction.

Used to pick up components with the placement arm directly from blue tape with the use of different eject tools. Supports snap rings and wafer frames.

Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.

The “Known Good Die" testing allows chip probing / testing prior to the bonding process.

Software extension for creating and using virtual forms in the camera image to support relative and face-up alignment processes.

For precisely setting a defined gap between component and substrate.

Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.

Used to handle substrates or components independently from the bonding tool.

For determining heights, lengths and coordinates of objects to be processed by image recognition (RGB illumination/coaxial illumination).

Allows sensing of heights by means of Laser triangulation for measuring purposes.

For determining heights, lengths and coordinates of objects to be processed by mechanical path measurement.

Allows using different achromatic lenses to adapt the field of view and optical resolution.

Automatic substrate or boat unloading from magazines / loading into magazines.

Automatic loading and unloading of large panels or substrates.

Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

For automatic loading / unloading of substrates. Width-adjustable for various substrate dimensions.

Activation / ignition of reactive materials such as nanofoils by laser pulse.

Allows ultra-fast heat cycles du to an integrated high power laser source

Lifting objects from conveyor units into a processing position.

Tilting unit with motorized angular adjustment in the axes phi(X) and phi(Y). This nick and roll movement can be used for parallel positioning or for bonding at certain angular positions.

Precise visual alignment of chip and substrate.

Preparation of assembly surfaces using atmospheric plasma for better wetting during joining processes.

SPC (Statistical Process Control) for dispensing volumes in the automatic process flow.

Accommodates 300 mm wafer cassettes. Programmable speed and slots.

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

Infeed/outfeed of objects for automatic processing in larger quantities on a minimal presentation area.

Accommodates 300 mm wafer cassettes. Programmable speed and up to 24 slots.

Automatically positions and indexes the wafer over the Die-Ejector.

Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.