Founded in 2020, TERASi is a deeptech startup based in Stockholm, Sweden, offering in-house design and manufacturing of unique components and packaging for high-frequency wireless applications. TERASi’s technology builds upon academic research at KTH Royal Institute of Technology and years of internal R&D. Now, they embark upon a mission to scale their technology and bring it to mass markets.
SiP for improved SWaP
TERASi develops a range of standalone products for wireless, radar and space applications.
This includes high gain, high efficiency antennas for backhaul, radar and SATCOM applications, compact, lightweight and high-performance filters, as well as precision waveguide standards for use in metrology as well as test and measurement applications. TERASi is now expanding into offering complete modules for wireless applications based on its innovative technology.
TERASi’s proprietary technology combines innovative scalable manufacturing solutions with advances in RF and semiconductor design to deliver hardware with industry leading size, weight and performance (SWaP) that will make our wireless future a reality.
Their modules use system-in-package (SiP) architectures, which separate active and passive components. This approach revisits fundamental principles to maximize efficiency, especially important with the rise of 5G/mm-wave and upcoming 6G technologies. Integrating active components in TERASi’s packages requires placing miniscule dies with high precision and repeatability, creating a need for new die-bonding solutions.
Key benefits are
- improved RF, mechanical and thermal performance
- higher efficiency through reduced RF loss
- lower cost, as the chips can be made simpler
Taking things into practice
To equip their ISO 9001:2015 and ISO 14001:2015 certified cleanroom facilities, TERASi was looking for a versatile and reliable die bonding solution that would support a wide range of potential applications in prototyping and later small series production.
In various sample runs, Finetech was able to prove general feasibility. For TERASi, this was very exciting as it was their first foray into practical implementation of their concepts.
Especially suited for TERAsi’s requirements was Finetech’s motorized 3 µm FINEPLACER® pico 2 tabletop die bonder, as it supported both 500N thermocompression bonding and stacking, as well as epoxy die attach with precision dispensing. When it crystallized during the quotation phase that ultrasonic applications were a possibility, a suitable ultrasonic bonding module was also added to the configuration.
To meet specific needs, Finetech also made several adaptations, including bonding tools and a custom substrate heating plate with customized vacuum channels.
Various fine tunings of the hardware and software makes life for the operators easier.
Beyond the machine
Besides machine installation and training, the Finetech team was happy to share their vast application experience and provides TERASi with additional technical guidance and process development support.
Today, TERASi is successfully employing the FINEPLACER® pico 2 to develop and build complete wireless modules using system-in-package solutions, with commercial launch targeted in early 2025.
