Higher pixel / Qubit count and interconnect density on larger and larger chips is driving hybridization and monolithic integration. This results in increased demand for fine pitch micro Indium Bump Interconnect (IBI) flip chip die bonding solutions.
The preferred way of hybridization to produce large format, high density infrared (IR) thermal imaging sensors according to industry requirements is by using fine pitch micro Indium bump array interconnect bonding.
However, there are specific challenges associated with Indium bump-to-bump die bonding.
The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.
Our Technical Papers provide basic knowledge on selected applications and technologies in a compact and comprehensible way and present suitable product and process solutions for their specific requirements.
Finetech rework systems for R&D and production environments are well suitable for miniature LED rework, such as those in form of SMD LED components (RGB) built into modern display systems.
Standard IC packages with an increased number of I/O pads suffer from larger volume, increased cost, increased wire bonding resistances and parasitic inductances while offering…
An overview about different interconnects used during the system evaluation of the FINEPLACER ® sigma
One defect solder ball is enough to render the complete BGA package unusable. The capability to replace single solder balls allows to save particularly valuable or legacy packages.
Precise placement of a new solder ball array is called array reballing. This repair process is applied when saving valuable resources (and money) is crucial or when the value chain has to be extended.
Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and are capable of high speed interconnections between
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