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FINEPLACER® coreplus

The All-Round Solution

Hot Air SMD Rework Station

The FINEPLACER® coreplus is a universal hot air rework station for electronic components and assemblies.

The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).

The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).

A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.

"The trend towards ever increasing data rates demands large bandwidths and thus usage of higher and higher frequencies. ICs are getting smaller and BGA-packages more common in an RF-Engineer‘s day to day work. The FINEPLACER® core gives us the means to handle those ICs reliably, saving us time and nerves. It is a great extension of our assembly technology."
Prof. Dr.-Ing. habil. Alexander Kölpin
Head of Institute for High Frequency Technology, Hamburg University of Technology

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Key Facts*

  • Full hot air rework system
  • Unique FINEPLACER® working principle
  • Industry-leading thermal management
  • In-situ process observation in HD
  • Data/media logging and reporting function
  • Full process access & easy visual programming with touch screen interface
  • Sequence control with predefined parameters
  • Placement accuracy better 10 µm
  • Versatile machine platform
  • Customer specific tooling
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • 3-color LED illumination
  • Full process access and easy programming
  • Synchronized control of all process related parameters
  • Software controlled top heater calibration
  • Modular machine platform allows in-field retrofitting during entire service life
  • Individual configurations with process modules
  • Fully manual or semi-automatic machine versions
  • Force controlled component handling

*depending on configuration

Applications & Processes

From small 008004 components to massive BGA – with a broad range of supported applications and processes, our professional SMD rework systems are ready to tackle any SMD rework challenge. With industry-leading thermal management and a modular hardware and software architecture, our SMD rework systems have been designed to yield reproducible process results for all steps of the SMD rework cycle.

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

  • Bar Code Reader "SmartIdent"

    Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

    Read more (PDF, 0.3 MB)
  • Direct Component Printing Module

    Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components

    Read more (PDF, 0.3 MB)
  • Dispense Module

    Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

    Read more (PDF, 0.3 MB)
  • Hot Beam 04

    Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted heating.

    Read more (PDF, 0.6 MB)
  • Hot Beam 05

    Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating source.

    Read more (PDF, 0.7 MB)
  • Hot Gas Bottom Heating Module

    Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.

    Read more (PDF, 0.4 MB)
  • Hot Plate

    HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED PCBs.

    Read more (PDF, 0.4 MB)
  • Manual Dipping Unit

    Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

  • MiniOven 05

    The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.

    Read more (PDF, 1 MB)
  • Presentation Module

    Ensures safe handling of components from GelPak

    Read more (PDF, 0.3 MB)
  • Process Gas Switching Module

    For an economic use of nitrogen as hot gas, to save resources, energy and money.

    Read more (PDF, 0.2 MB)
  • Process Start Sensor

    Because reproducibility matters | Measures the temperature of a defined point on the board surface for reproducible process conditions.

    Read more (PDF, 0.2 MB)
  • Process Video Module

    Allows the in-situ observation of the working area during the bonding process

    Read more (PDF, 0.3 MB)
  • RGW-Illumination

    Description coming soon

  • Reballing Module

    Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

    Read more (PDF, 1.5 MB)
  • Smart Desolder 01

    Non-contact extraction of residual solder using a manual hot-gas source with a vacuum pen. Remove components without re-applying heat and pressure to PCB.

    Read more (PDF, 0.5 MB)
  • Solder Removal Module

    Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

    Read more (PDF, 0.3 MB)
  • Split Field Optics

    For a precise alignment of large components via edges | Allows two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.

  • Substrate Heating Module

    Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

  • Substrate Support

    Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

    Read more (PDF, 0.5 MB)
  • Target Finder

    A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

    Read more (PDF, 0.3 MB)
  • Top Heating Module (Hot Gas)

    Allows the heat transfer from the top with hot gas and chip specific tool design to control temperature from the chip direction.

    Read more (PDF, 0.3 MB)
  • Touch Screen "SmartControl"

    Allows the intuitive use of the software with established multi touch functions and a navigation based on real PCB images.

    Read more (PDF, 0.2 MB)
  • Traceability Module

    Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

  • Vision Alignment System (VAS)

    Precise visual alignment of chip and substrate.

    Read more (PDF, 0.7 MB)
  • Zoom Optics

    Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates

Videos

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bga-rework-thmb
Play Video

BGA Rework

Desoldering, soldering, residual solder removal on flat panel TV PCB.

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bga-Reballing-thmb
Play Video

BGA Reballing

This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.

By using this element, you agree that your data will be transmitted to external services (https://www.youtube-nocookie.com) and that you have read our privacy policy.

rework-of-gpu
Play Video

Rework of GPU

Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.

Technical Paper

Rework of BGA/CSP and CPU/GPU SMD

The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.

Rework of Mini-LED Arrays

Finetech rework systems for R&D and production environments are well suitable for miniature LED rework, such as those in form of SMD LED components (RGB) built into modern display systems.

Overview of Technical Papers

Our Technical Papers provide basic knowledge on selected applications and technologies in a compact and comprehensible way and present suitable product and process solutions for their specific requirements.
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