Autor: Michael Wolff
Abstract: RFID chips (Radio Frequency Identification) are increasingly used in industrial and consumer products. Typical fields of application include door access control systems or product tracking and tracing. RFID chips come in sizes from several millimeters down to a few microns, with very thin and flexible substrates prone to thermal stress. The components include passive RF circuits with 2-4 solder bumps. Two bumps have electrical properties; any additional bumps ensure mechanical stability. Finetech die bonders are ideally suited for the RFID chip assembly on various substrates in R&D as well as in full series production. This document describes typical challenges of the multi assembly of RFID chips on flexible substrates using a 2-component-adhesive as well as Finetech solutions to prepare a process transfer from small series to full production.