Your vision brought to life
Our R&D Bonders are ready to tackle the challenges of today and tomorrow.
Flexible, accurate and retrofittable at all times.
FINEPLACER® sigma
Advanced Sub-Micron Bonder
FINEPLACER® lambda 2
Sub-Micron Table Top Die Bonder
FINEPLACER® pico 2
Multi-Purpose Bonder
Customer Stories
Solutions that make a difference
Finetech die bonders for research & development are first choice wherever highest placement accuracy, technological diversity and rapid implementation of different assembly processes are required.
For an optimal range of applications, all machines can be configured flexibly according to your needs and retrofitted for additional tasks.
FINEPLACER® femtoblu
High Accuracy Bonder
FINEPLACER® femto 2
Advanced Sub-Micron Bonder
