Author: Marcus Nieder
Abstract: Fiber laser solutions are increasingly replacing traditional methods for cutting, welding and marking applications. While the manufacturing costs of semiconductor laser chips have been continuously reduced in recent years, the single largest cost factor in the manufacturing of optoelectronic components today is in the assembly and packaging. A major factor is the still manual production step of the second- level packaging. To solve this problem, Finetech evaluated and now offers an automatic solution to utilize bonding via reactive multilayer systems (RMS) for packaging of CoS onto a heat sink, which is presented in this Technical Paper.