Due to the beneficial characteristics, the preferred way of hybridization to produce state-of-the-art large format, high density infrared (IR) thermal imaging sensors is by using fine pitch micro Indium bump array interconnect bonding.
However, Indium bump-to-bump die bonding is probably the most challenging part of thermal imaging IR sensor bonding/hybridiziation and some specific challenges are associated with it, such as
- Excessive preparation times, caused by lengthy machine setup and programming, material cleaning and co-planarity adjustment,
- Trouble with inconsistencies in the bonding process due to lacking co-planarity and surface flatness, and
- Generally high complexity in maintaining yield and throughput impacted by insufficient bonding results.
As a result, bonding processes are not automated, inconsistent, and manufacturing time and costs increase.
In order to tackle these challenges and provide the industry with an easy-to-use, efficient and reliable solution, Finetech has developed standardized Indium bump interconnect/hybridization processes:
- Fully Automated Indium bonding process, four or more assemblies per cycle
- Cold Compression bonding up to 1000N, the ideal way to address the issue of CTE mismatch in cryogenic IR imaging applications
- Thermal Compression bonding below 100°C
- Formic Acid Indium oxide reduction below 220°C + Cold/Thermal Compression Bonding in an inert gas environment
- Formic Acid reflow bonding down to 0.05 N PID Force controlled bond
Our hybridization processes for IR sensor devices are based on standardized hardware and process solutions for everything from manual to fully automated bonding and allow you to get your IR sensor assembly up and running within 6 hours.
Consistency in parameters and their execution such as accuracy, force, time, and temperature ensures uniform, reliable and repeatable bonding quality across large pixel arrays and multiple assemblies. By accomplishing 99%+ pixel yield consistency on 640×512 SWIR sensors and more, our solutions allow you to push the envelope of how your IR sensors are able to perform.
Click here to download our technical paper on IR Sensor Assembly with Indium Bump Interconnect Flip Chip Bonding.
