Author: Ralph Schachler, Martin Rogge
Abstract: For assembly systems (die bonder) used in microelectronics packaging, the specified placement accuracy is an essential key figure to consider and understand. However, in the industry, it is often unclear which accuracy technique is being used how or when it is measured. Finetech relies on a transparent and verifiable method of how the accuracy of our placement and assembly systems is measured and specified.
This technical paper explains the context, as well as the factors that influence accuracy, it will show conclusions customers can draw for themselves from the specified accuracy of Finetech products and explain why some market competitors present the topic too vaguely and ultimately not correctly.
