Accuracy meets automation
Easy process transition from concept and development to production.
For your ideas in series.
FINEPLACER® femtoblu
High Accuracy Bonder
FINEPLACER® femto 2
Advanced Sub-Micron Bonder
FineXT 6003
Speed and Precision in Production
Customer Stories
Solutions that make a difference
Finetech die bonders for fully-automated industrial micro assembly combine optimized throughput with high placement accuracy and unrivaled process flexibility.
Due to their modular platform design, automated systems by Finetech can be easily adjusted to the ever-changing technological trends, becoming a future-proof investment and a perfectly fitting solution for your production needs.
