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Finetech Showcases the Fastest FINEPLACER® Yet at LASER World of PHOTONICS 2025
Finetech announces the debut of its fastest production die bonder to date at LASER World of PHOTONICS 2025.
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HOTSTACK Project to Usher in a New Era of Pulsed Laser Technology
In a significant leap forward for pulsed laser technology, the HOTSTACK project, led by Trumpf GmbH in collaboration with Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH), LayTec
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Smart Desolder 01
Non-contact extraction of residual solder using a manual hot-gas source with a vacuum pen. Remove components without re-applying heat and pressure to PCB.
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Hot Plate
HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED
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Hot Beam 04
Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted
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Hot Beam 05
Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating
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MiniOven 05
The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.
Projekt #2
Bavaria ipsum dolor sit amet no pfundig, Kaiwe. Hod scheans eana d’ zünftig da. De Leonhardifahrt und sei Fingahaggln woaß Kneedl, damischa mogsd a Bussal.
Projekt #1
Bavaria ipsum dolor sit amet no pfundig, Kaiwe. Hod scheans eana d’ zünftig da. De Leonhardifahrt und sei Fingahaggln woaß Kneedl, damischa mogsd a Bussal.
