As a complement to our advanced rework equipment, or on their own, these rework accessory systems provide unique pre-heating, reballing and desoldering solutions.
The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.
Hot Beam 05
Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating source.
Hot Beam 04
Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted heating.
HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED PCBs.