Promex Industries, a stalwart of Silicon Valley’s semiconductor innovation landscape since 1975, transitioned in 2008 to specialize in custom assembly processes for devices requiring non-electronic parts. This strategic pivot was perfectly aligning with the ever-increasing demand for Heterogeneous Integration.
Today, Promex’s capabilities span from feasibility prototype development to full production, all within their state-of-the-art fully integrated component assembly facility in Santa Clara, California.
This includes, for example, MEMS, implantables and high I/O count devices for markets as diverse as Quantum Computing, Medical Technology, Photonics & Optoelectronics, as well as for academic research.
Partnering on the Journey from Prototype to Production
At Finetech, our mission is clear: to solve complex component assembly challenges with precision and reliability. We are proud to be a trusted partner for Promex for the entire journey from R&D and prototyping to production, providing advanced solutions that enhance their complex IC packaging and assembly.
To strengthen their research, prototyping, and production capabilities, Promex was looking for a die bonder solution that could offer:
- Outstanding placement accuracy
- Precise low-end force control
- High-quality vision system for fine-pitch devices
Two key objectives were to prevent shorting caused by excessive force during the attachment process and to address planarity issues that complicated the assembly of large IO devices to thin substrates like flex.
The Solution: FINEPLACER® sigma
Our FINEPLACER® sigma system was the perfect fit for Promex’s needs, as this semi-automated sub-micron die bonder provides:
- Enhanced Placement Accuracy: Critical for the assembly of fine-pitch devices, the Sigma’s precision significantly reduced alignment errors.
- Superior Low-End Force Control: Ensuring delicate components are handled with care, preventing damage and ensuring reliable connections.
- Advanced FPXvisionTM Vision System: Offering high-resolution imaging for high-precision inspection and best alignment accuracy.
To address the planarity challenges, we also introduced a gimbaling tool head, replacing the traditional thick tool head. This innovation allowed Promex to achieve better control over bondline thickness and ensured consistent assembly quality.
The Benefits for Promex
The implementation of the FINEPLACER® sigma system delivered multiple benefits to Promex, including:
- Improved Connection Quality: Enhanced connections of large IO devices to thin substrates with precise force control and accurate placement.
- Increased Throughput: Achieving higher production rates while maintaining consistent quality.
- Optimized Bondline Control: Better management of bondline thickness, ensuring robust and reliable assemblies.
- Ease of Use and Training: New processes can easily be developed and new users can be trained to robustly run these processes.
A Partnership Built on Trust
Our long-standing relationship with Promex and QP Technologies underscores the value we bring to our customers. In addition to the latest Finetech system, Promex has one of the first FINEPLACER® pico systems in the United States, and we have always supported them with exceptional service and technical expertise. Our team is readily available for consultations, installation, and training, ensuring that Promex can tackle new challenges with confidence.
Our US-bases sales and support experts assisted Promex in transferring programs between the systems, ensuring a seamless transition and maximizing the benefits of the new technology.
At Finetech, we are dedicated to empowering our customers with cutting-edge solutions that drive innovation and efficiency. Our partnership with Promex exemplifies how our advanced technologies, like the FINEPLACER® sigma, can solve complex assembly challenges and enhance production capabilities.
For more information on how Finetech can support your advanced assembly needs, contact us today. Together, we can transform your concepts from prototype to full-scale production.
