Latest News & Press Information
Read the latest news about our product and company activities.
New Plasma Treatment Module Now Available for the FINEPLACER® femto Platform
Finetech introduces a new Plasma Treatment Module for the FINEPLACER® femto platform. Integrated atmospheric Argon plasma enables in-situ surface preparation inside the die bonder for stable bonding and scalable advanced packaging.
Finetech Unveils Beta Prototype of Next-Generation High-Volume Production Die Bonder
The modular platform supports multiple bonding technologies and 12-inch wafers, enabling manufacturers to consolidate diverse advanced packaging processes in one system.
Finetech Presents Next-Generation Die Bonding Solutions at Productronica 2025
At this year’s Productronica (November 18–21, 2025), Finetech GmbH & Co. KG invites visitors to discover the future of precision die bonding and micro-assembly in Hall B2, Booth 405.
Finetech Showcases the Fastest FINEPLACER® Yet at LASER World of PHOTONICS 2025
Finetech announces the debut of its fastest production die bonder to date at LASER World of PHOTONICS 2025.
Martin GmbH Ceases Operations – Finetech and Mexser Ensure Continuity
After many successful years as a subsidiary of Finetech, Martin GmbH will cease operations in May 2025.
FINEPLACER® femto pro – The Efficient Solution for Advanced Packaging
Finetech introduces the FINEPLACER® femto pro, the next-generation automated die bonder for high-yield and sustainable mid-volume production.