Latest News & Press Information
Read the latest news about our product and company activities.
Finetech Presents Next-Generation Die Bonding Solutions at Productronica 2025
At this year’s Productronica (November 18–21, 2025), Finetech GmbH & Co. KG invites visitors to discover the future of precision die bonding and micro-assembly in Hall B2, Booth 405.
Finetech Showcases the Fastest FINEPLACER® Yet at LASER World of PHOTONICS 2025
Finetech announces the debut of its fastest production die bonder to date at LASER World of PHOTONICS 2025.
Martin GmbH Ceases Operations – Finetech and Mexser Ensure Continuity
After many successful years as a subsidiary of Finetech, Martin GmbH will cease operations in May 2025.
FINEPLACER® femto pro – The Efficient Solution for Advanced Packaging
Finetech introduces the FINEPLACER® femto pro, the next-generation automated die bonder for high-yield and sustainable mid-volume production.
Finetech to Demonstrate Advanced Die Bonding Solutions at Photonics West 2025
Finetech announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.
Season’s Greetings from Finetech
As the holiday season approaches, we at Finetech wish to extend our warmest greetings to you and your loved ones. This festive season is a time for reflection, gratitude, and looking forward to new beginnings. Throughout the year, we have been committed to advancing the field of sub-micron die bonding,
