Productronica 2023:
Tailored Die Attach Solutions at Booth B2-403!

 +++  We would like to thank our many visitors, familiar and new faces, with whom we had many great conversations. We are already incredibly excited to be working with you to bring your product visions to life!  +++

Finetech is a leading supplier of manual and automatic die bonders with more than 30 years of experience in high-precision micro assembly and advanced die attach.

In close cooperation with our customers, we create tailored process and equipment solutions for individual customer requirements. The modular die bonder hardware and software enables customized machine configurations that can be expanded and prepared for new challenges at any time.

Thanks to our “prototype-to-production” approach, R&D processes can effortlessly be transferred from development to production for integrated, flexible and cost-efficient product development.

Let’s find out how our team can support your project with long-standing expertise, innovative technical solutions and 100% commitment to the challenge.

 +++  We would like to thank our many visitors, familiar and new faces, with whom we had many great conversations. We are already incredibly excited to be working with you to bring your product visions to life! +++

Finetech is a leading supplier of manual and automatic die bonders with more than 30 years of experience in high-precision micro assembly and advanced die attach.

We create tailored solutions for individual customer requirements. Our “prototype-to-production” approach enables integrated, flexible and cost-efficient product development.

Contact us

Highlights

Fine Pitch Micro Indium Bump Array Bonding
Finetech has developed highly repeatable high yield assembly processes and equipment to produce large-scale, high-density IR thermal imaging FPA devices, quantum processors or micro LED displays.

Quick machine setup and clever material handling and cleaning solutions reduce preparation time by up to 50%.

Master the fine pitch micro Indium bump interconnect flip chip bonding process to manufacture state-of-the-art products more efficient than ever.

#Co-planarity #Accuracy #Cleaning #OxideReduction #Handling #InterconnectQuality #Throughput #Yield #CostPerBond #ConnectedPixelRate
CoC / CoS Laser Diode Module Manufacturing

Have you considered manufacturing the CoC/CoS diode lasers for your laser modules yourself? Partner with Finetech and take the development and production of your laser modules into your own hands.

Your benefits: technology sovereignty, customizability, cost reduction, increase in reliability and quality.

Manufacture diode lasers with specific properties that are unique on the market.

#Photonics #Optoelectronics #LaserBarBonding #SingleLaserBonding #LensPlacement #FiberOpticsAssembly
Reactive Soldering with RMS
Reactive soldering allows for fast and localized soldering of mid-sized to large components into packages with high thermal mass.

A laser pulse is used to activate or ignite reactive multilayer systems (RMS) such as preforms or nanofoils.

It is a very efficient bonding technology and perfectly suited for automated multi-chip module assembly.

#ReactiveSoldering #Nanofoil #ReactiveMultilayerSystem #Preform #LaserActivation #MultiChipModule
Your Process Refined
In advanced die packaging, hardware and software needs to be 100% in tune with each other and with the application. Each piece of the process puzzle must fit perfectly.

For optimal results in terms of process efficiency, reliability and yield, we keep improving and innovating on all process parameters. Together with our customers, we love to push the limits of what is possible.

Some of the recent fields of innovation include improved machine and process parameters (optimized force and temperature control, thermal drift control), process modules (plasma cleaning, UV curing, ultrasonic bonding, laser activation, enhanced process gas implementation, material cleaning and handling, as well as tooling (3D printed designs, special coatings and materials, application-specific solutions).

How can we take your assembly processes to the next level?
Applications Unlimited
Our core strengths are flexibility, adaptability and accuracy. In our machines and in our minds.

Based on this, we develop optimal process solutions for a wide range of different applications together with customers from a wide variety of industries.

These include die attach and packaging of Photonics / Silicon Photonics components as well as Sensors and Detectors, Electronic Devices, Actuators, Displays, Fluidic Devices and many more.

We look forward to learning more about your unique application challenge during Productronica 2023.
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FINEPLACER® femtoblu

The Efficient Solution for Photonics Production

An automated micro assembly cell with placement accuracy of 2 µm @ 3 Sigma and ultra-low bonding force capability. 

The modular FINEPLACER® femtoblu can be individually configured and upgraded in-field to support additional applications and technologies in the field of photonics.

csm_Website_Header_femtoblu_rev01_web_86fe199f29
csm_Website_Header_femtoblu_rev01_web_86fe199f29

FINEPLACER® femtoblu

The Efficient Solution for Photonics Production

An automated micro assembly cell with placement accuracy of 2 µm @ 3 Sigma and ultra-low bonding force capability. 

The modular FINEPLACER® femtoblu can be individually configured and upgraded in-field to support additional applications and technologies in the field of photonics.

csm_Produktbild_pico-2_Reinraum_rev01_web_e5d2f7b221

FINEPLACER® pico 2

The Most Powerful Tool for Lab & Research

Our multi-purpose, manual die bonder with placement accuracy down to 3 µm. Ideal for fast and flexible product development and prototyping in R&D labs and universities.

The FINEPLACER® pico 2 offers an outstanding return on investment and is a natural starting point on the journey from concept to final product.

NEW: Integrated Die-Eject Module

FINEPLACER® femto 2

Advanced Automated Sub-Micron Bonder

Fully-automated die bonder offers unrivaled flexibility for prototyping & production environments.

The modular design of the automated die bonder FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies.

FINEPLACER® femto 2

Advanced Automated Sub-Micron Bonder

Fully-automated die bonder offers unrivaled flexibility for prototyping & production environments.

The modular design of the automated die bonder FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies.

Contact us

Tradeshow impressions

Explore our post-tradeshow gallery, where the excitement of Productronica Munich 2023 lingers. From display of our cutting-edge automated and prototyping die bonding machines to snapshots from insightful customer meetings that shaped our connections.

Why Finetech?

✓ Expertise Beyond Measure: We are the die bonding experts who thrive on challenges. Your obstacles become our opportunities to help you, and together, we achieve remarkable results.

✓ Tailored Solutions: No two projects are the same. That’s why we offer customized solutions, providing you with machines and processes designed to fit your unique requirements.

✓ From Concept to Market: Our “Prototype-to-Production” approach enables fast, low-risk flexible product development and seamless process transfer from R&D to production.

✓ Accuracy Redefined: For us, accuracy goes beyond placement accuracy. It’s a commitment to perfection in every aspect of die bonding.

✓ Lifelong Flexibility: Our support doesn’t end with a sale. We are dedicated to offering flexibility throughout your machine’s lifecycle, ensuring it adapts to your changing needs.

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