The All-Round Solution
Hot Air SMD Rework Station
The FINEPLACER® coreplus is a universal hot air rework station for electronic components and assemblies.
The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).
The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).
A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.
- Full hot air rework system
- Unique FINEPLACER® working principle
- Industry-leading thermal management
- In-situ process observation in HD
- Data/media logging and reporting function
- Full process access & easy visual programming with touch screen interface
- Sequence control with predefined parameters
- Placement accuracy better 10 µm
- Versatile machine platform
- Customer specific tooling
- Overlay vision alignment system (VAS) with fixed beam splitter
- 3-color LED illumination
- Full process access and easy programming
- Synchronized control of all process related parameters
- Software controlled top heater calibration
- Modular machine platform allows in-field retrofitting during entire service life
- Individual configurations with process modules
- Fully manual or semi-automatic machine versions
- Force controlled component handling
*depending on configuration
Applications & Processes
From small 008004 components to massive BGA – with a broad range of supported applications and processes, our professional SMD rework systems are ready to tackle any SMD rework challenge. With industry-leading thermal management and a modular hardware and software architecture, our SMD rework systems have been designed to yield reproducible process results for all steps of the SMD rework cycle.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
- Manual Dipping Unit
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Description coming soon
- Split Field Optics
For a precise alignment of large components via edges | Allows two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.
- Substrate Heating Module
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
- Traceability Module
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
- Zoom Optics
Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates
Desoldering, soldering, residual solder removal on flat panel TV PCB.
This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.
Rework of GPU
Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.