The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
Using tiny polymer spheres coated with gold will allow an electrical connection to be made between a die and substrate.
In my last blog I wrote about the challenges involved with thermo-sonic bonding of large die. Thermo-sonic bonding of smaller die presents…
Thermo-sonic bonding is the process of flip chip bonding a die to a substrate using gold as the interconnect while avoiding high temperatures.
Aligning a 4-channel VCSEL and a 4-channel photo diode together on a PCB, using conductive epoxy, is a challenging application for most telecom companies that develop and manufacture VSR or