MicroLED Manufacturing with Finetech – Accurate, Efficient and Scalable
If you’re working in MicroLED manufacturing, you may have already encountered challenges such as precise micro bump handling, high operational costs, slow scalability, fragile chip management, or the need for efficient Indium interconnect cleaning.
We help you overcome these challenges with FINEPLACER® die bonders and our standardized Indium Bump Interconnect process for MicroLED including handling and cleaning solutions. It’s accurate, cost-effective, fast – and designed to carry your MicroLED product all the way from prototyping to volume manufacturing.
Are you working on MicroLED arrays and looking for a solution that ensures accuracy, cost-effectiveness, and seamless scaling from R&D to volume manufacturing?
Are you working on MicroLED arrays and looking for a solution that ensures accuracy, cost-effectiveness, and seamless scaling from R&D to volume manufacturing?
Driven by miniaturization, improved mass transfer, cost reduction, and advancements like flexible displays and enhanced color accuracy, MicroLED is rapidly becoming the preferred technology for diverse applications in automotive, augmented reality or high-end wearables. Scaling for larger displays and vertical integration are also expanding its viability across industries.
At Finetech, we provide comprehensive solutions for MicroLED manufacturing. Our precise die bonders and Indium Bump Interconnect processes ensure high accuracy, scalability, and cost-efficiency.
Whether you’re in the prototyping phase or scaling to mass production, our systems provide the flexibility and reliability needed to achieve superior display performance, while reducing waste, energy consumption, and operational costs, helping you stay competitive in the evolving MicroLED market.
Driven by miniaturization, improved mass transfer, cost reduction, and advancements like flexible displays and enhanced color accuracy, MicroLED is rapidly becoming the preferred technology for diverse applications in automotive, augmented reality or high-end wearables. Scaling for larger displays and vertical integration are also expanding its viability across industries.
At Finetech, we provide comprehensive solutions for MicroLED manufacturing. Our precise die bonders and Indium Bump Interconnect processes ensure high accuracy, scalability, and cost-efficiency.
Whether you’re in the prototyping phase or scaling to mass production, our systems provide the flexibility and reliability needed to achieve superior display performance, while reducing waste, energy consumption, and operational costs, helping you stay competitive in the evolving MicroLED market.
Finetech Partners with Polar Light Technologies in MicroLED development
Supporting Polar Light Technologies with cutting-edge FINEPLACER® die bonding solutions, this partnership strengthens PLT’s ability to scale up their patented pyramidal microLEDs and set new technology standards. With the right foundation in place, Polar Light Technologies is well-positioned to achieve the performance and scalability required to bring next gen microLED to the market.
What Does Our Standardized MicroLED Solution Entail?
FINEPLACER® Die Bonders – Accurate, Scalable, Cost-Effective
Achieve high-quality bonding with our FINEPLACER® systems, which deliver sub-micron accuracy for manual, semi-automated, and fully automated solutions.
From small-scale projects to full production, our bonders ensure superior display quality and meet the intricate demands of MicroLED manufacturing.
- Sub-micron Accuracy & Superior Repeatability
- Cost-effective Solutions for All Project Sizes
- High Yield and Reliability for Superior Display Quality
Cold Compression Indium Bump Interconnect Bonding Process
Our standardized Indium Bump Interconnect (IBI) solutions provide efficient, reliable, and cost-effective processes for MicroLED display manufacturing. By streamlining development, we help reduce both time and costs, ensuring seamless progress from design to market.
With precision alignment and bonding technologies, our solutions achieve sub-micron flatness and co-planarity for optimal display performance. Additionally, our Cold Compression bonding process minimizes waste and energy consumption, delivering sustainable manufacturing without compromising on quality.
Seamless Transition: From R&D to In-house Manufacturing
Our versatile die bonder lets you effortlessly scale production and adapt to evolving MicroLED technologies. This ensures you stay competitive and can expand your capabilities with a solution designed for future growth.
They also help you to achieve manufacturing autonomy, empowering you to eliminate supply chain dependencies by bringing production in-house. Gain unparalleled control over quality, efficiency, and yield, while reducing reliance on external suppliers.
Dedicated Material Kitting Pack and In-situ Atmospheric Plasma Treatment
Our material kitting packs enable tweezer-free loading, handling and flipping, minimizing the risk of damage and contamination. This approach ensures the integrity of delicate materials for flawless MicroLED displays.
Our integrated plasma cleaning module enhances your bonding by treating materials immediately before bonding, streamlining production and reducing dependencies on multiple machines and operators. Achieve optimal efficiency and performance in your bonding process.
Finetech Partners with Polar Light Technologies in MicroLED development
Supporting Polar Light Technologies with cutting-edge FINEPLACER® die bonding solutions, this partnership strengthens PLT’s ability to scale up their patented pyramidal microLEDs and set new technology standards. With the right foundation in place, Polar Light Technologies is well-positioned to achieve the performance and scalability required to bring next gen microLED to the market.
